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Core Nanofabrication

The Core Nanofabrication cleanrooms provide the ideal environment to produce high-quality devices. With an extensive range of equipment, they can support activities with a broad variety of materials including compound semiconductors, silicon, diamond and organic semiconductor materials from chips to small batches of wafers.

The cleanrooms offer a full range of routine fabrication capabilities including:

Mask-based photolithography (chips to 6” wafers)
Thermal and e-beam evaporation of metals
Dielectric deposition by PECVD and ALD

Dry etching of dielectrics, compound semiconductor materials and silicon
Metrology, inspection and testing
Cleaving, Sawing and die packaging

The Core Nanofabrication cleanrooms provide the ideal environment to produce high-quality devices. With an extensive range of equipment, they can support activities with a broad variety of materials including compound semiconductors, silicon, diamond and organic semiconductor materials from chips to small batches of wafers.

The cleanrooms offer a full range of routine fabrication capabilities including:

Mask-based photolithography (chips to 6” wafers)
Thermal and e-beam evaporation of metals
Dielectric deposition by PECVD and ALD

Dry etching of dielectrics, compound semiconductor materials and silicon
Metrology, inspection and testing
Cleaving, Sawing and die packaging.

Mask-based photolithography (chips to 6” wafers)
Thermal and e-beam evaporation of metals
Dielectric deposition by PECVD and ALD

Dry etching of dielectrics, compound semiconductor materials and silicon
Metrology, inspection and testing
Cleaving, Sawing and die packaging

Our Capabilities

Photolithography

Manual spin coaters, manual mask aligners, manual development for chips and small wafers up to 3” diameter

Dry etching

Dielectrics, III-V materials, potentially silicon (mainly for photonics, mems)

Deposition of metals

Thermal, sputter, self-contained systems for deposition of thermal and beam evaporation. Deposition of single films and multilayer stacks of metal.

Dielectric deposition

Including plasma-enhanced chemical vapor deposition (PECVD) using silicon nitride (SiNx) and silicon oxide (SiOx), and thermal atomic layer deposition (ALD).

Metrology, inspection and testing

Surface profiling (stylus; AFM), Dielectric thin film characterisation (ellipsometry), optical microscopy.

Wafer cleaving and sawing

Wafer cleaving and sawing plus basic device packaging

Operating Modes

Service Mode

Enquire about this Facility

If you are new to CORDE we would recommend contacting us via the form below to ensure we can help you with a detailed response. Or you can contact the Core Nanofabrication Facility Scientist directly at nanofab@phy.cam.ac.uk.

Research @ Cambridge

Cavendish Laboratory

Core Nanofabrication

The cleanrooms offer a full range of routine fabrication capabilities including:

The cleanrooms offer a full range of routine fabrication capabilities including:

Our Capabilities

Photolithography

Wet processing

Dry etching

Deposition of metals

Dielectric deposition

Metrology, inspection and testing

Wafer cleaving and sawing

Operating Modes

Service Mode

Enquire about this Facility

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Research at Cambridge