Home » Nanofabrication » Core Nanofabrication » Deposition of Metals
A small suite of thermal and e-beam evaporators, for the depositions of single films or multilayer stacks. Typically the available metals are grouped into ohmic material or gates material (see below). The evaporators can accommodate chips upto 4″ wafers with a range of uniformity (see below).
Ohmic and gate materials are evaporated in dedicated tools in order to minimise cross contamination and to maximise yield. Other general purpose evaporators are then used for less standard materials
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Turnaround time is generally from one week, although this could be faster or slower depending on the work package; please contact us for more details.
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