Deposition of metals

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Brief description

A small suite of thermal and e-beam evaporators, for the depositions of single films or multilayer stacks. Typically the available metals are grouped into ohmic material or gates material (see below). The evaporators can accommodate chips upto 4″ wafers with a range of uniformity (see below).

Applications and uses

Metal deposition is a key fabrication device step, for the formation of ohmic contacts, bond pads, gates and on-chip tracks. We offer a wide range of thermal and electron beam evaporation tools in order to allow the deposition of most metals.

Components and further details

Ohmic and gate materials are evaporated in dedicated tools in order to minimise cross contamination and to maximise yield. Other general purpose evaporators are then used for less standard materials

Compatibility

n-type ohmic material for compound semiconductors: AuGeNi (thermal) PdGeAu (thermal or UHV e-beam)
gate materials Ti/Au; Cr/Au; NiCr/Au (Thermal) Ti/Pd/Au; Ti/Pt/Au (e-beam)
other metals: Al; Ag; InZn; Ni (thermal). Thermal evaporators suitable for multiple chips and wafers up to 4″ (with reduced uniformity)
e-beam evaporator – Sample mount for chips (upto 10 chips at once), 2″, 3″ and 4″ substrates

Usage restrictions

not applicable

Booking

Whether you are new to the National Facility or have visited us before, our Getting Access page contains more information about booking our services.

Availability and lead times

Turnaround time is generally from one week, although this could be faster or slower depending on the work package; please contact us for more details.

Pricing

For pricing details and more information about the services we can provide please contact us.

Enquire about this instrument

If you are new to CORDE we would recommend contacting us via the form below to ensure we can help you with a detailed response. Or you can contact the team directly at nanofab@phy.cam.uk.

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Research @ Cambridge

Cavendish Laboratory