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Wafer cleaving and sawing, as well as basic device packaging.
Wafer cleaving and sawing, as well as basic device packaging
We offer wafer saw and cleaving solutions to suit various materials. We also have a selection of wire bonders (ball and wedge) to allow electrical hookup.
Whether you are new to the National Facility or have visited us before, our Getting Access page contains more information about booking our services.
Turnaround time is generally from one week, although this could be faster or slower depending on the work package; please contact us for more details.
For pricing details and more information about the services we can provide please contact us.
We’re happy to help; please contact us using the form above. Or try our searchable equipment directory for an overview of everything CORDE has to offer.