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Cavendish Laboratory

Wafer cleaving and sawing

Brief description

Wafer cleaving and sawing, as well as basic device packaging.

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wafer-saw

Wafer cleaving and sawing

Home  >>  Nanofabrication  >>  Core Nanofabrication  >>  Wafer Cleaving and Sawing

Brief description

Wafer cleaving and sawing, as well as basic device packaging

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scriber
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wafer-saw

Applications and uses

To complete the device fabrication process, techniques to singulate individual devices and then to electrically connect your device to a package are required. 

Components and further details

We offer wafer saw and cleaving solutions to suit various materials. We also have a selection of wire bonders (ball and wedge) to allow electrical hookup.

Compatibility

  • Wafer saw for silicon and selected other materials by agreement
  • Substrates up to 4″
  • K&S wedge and ball bonders
  • Typically using gold wire but can also be configured for aluminium wire and gold ribbon wedge bonding.

Usage restrictions

Not applicable

Booking

Whether you are new to the National Facility or have visited us before, our Getting Access page contains more information about booking our services. 

Availability and lead times

Turnaround time is generally from one week, although this could be faster or slower depending on the work package; please contact us for more details.

Pricing

For pricing details and more information about the services we can provide please contact us.

Enquire about this instrument

If you are new to CORDE we would recommend contacting us via the form below to ensure we can help you with a detailed response. Or you can contact the team directly at nanofab@phy.cam.uk.
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