Wafer cleaving and sawing
Wafer cleaving and sawing Brief description Wafer cleaving and sawing, as well as basic device packaging. Jump to booking Wafer cleaving and sawing Brief description Wafer cleaving and sawing, as well as basic device packaging Jump to enquiry Applications and uses To complete the device fabrication process, techniques to singulate individual devices and then to […]
Metrology, inspection and testing
Metrology, inspection and testing Brief description Surface profiling (stylus; AFM, dektak) Dielectric thin film characterisation (ellipsometry) optical microscopy and probe stations Jump to booking Brief description Surface profiling (stylus; AFM, dektak) Dielectric thin film characterisation (ellipsometry) optical microscopy and probe stations Jump to enquiry Metrology, inspection and testing Applications and uses We offer […]
Dielectric Deposition
Dielectric deposition Brief description Including plasma-enhanced chemical vapor deposition (PECVD) of silicon nitride (SiNx) and silicon oxide (SiOx), thermal atomic layer deposition (ALD) and e-beam evaporation of AlOx. Jump to booking Dielectric deposition Brief description Including plasma-enhanced chemical vapor deposition (PECVD) of silicon nitride (SiNx) and silicon oxide (SiOx), thermal atomic layer deposition (ALD) […]
Deposition of Metals
Deposition of metals Brief description A small suite of thermal and e-beam evaporators, for the depositions of single films or multilayer stacks. Typically the available metals are grouped into ohmic material or gates material (see below). The evaporators can accommodate chips upto 4″ wafers with a range of uniformity (see below). Jump to booking […]
Dry etching
Dry Etching Brief description We have a small suite of dry etch tools for both reactive ion etching (RIE) and inductively coupled plasma (ICP) etching. These tools have a range of process gases, with dedicated tools for Chlorine-based etching of III-V semiconductors and Fluorine-based etching of dielectrics. Jump to booking Dry Etching Brief description We have […]
Wet processing
Wet processing Brief description Dedicated laminar flow wet benches for work with solvents and acids. Wet etching and cleaning of samples, ranging in size from chips upto 4″ wafers. This includes using hydrofluoric acid (HF) and piranha for etching/cleaning. Jump to booking Wet processing Brief description Dedicated laminar flow wet benches for work with […]
Photolithography
Photolithography Brief description Our nanofabrication photolithography room has manual spin coaters and manual mask aligners for chips and up to 3″ wafers, utilising a range of resists and manual development processes. Jump to booking Photolithography Brief description Our nanofabrication photolithography room has manual spin coaters and manual mask aligners for chips and up to […]
III-V Growth
III-V Growth Brief description Our Growth Facility houses two III-V MBE growth systems (‘W’ and ‘V’ Chambers) with identical configurations and in-situ monitoring capabilities capable of a growth temperature range between 0°C to 1000°C and group III materials/dopants. Many of the device structures grown by the group (over 10,000 to date) have been replicated in […]
Topological Materials Growth
Topological Materials Growth Brief description The Topological Materials dual chamber MBE has been designed for epitaxial growth of thin films of emerging classes of materials; topological (Bi-Sb-Te family); Weyl semi-metals (MoTe2); ferromagnetic; and antiferromagnetic (Mn alloys). Jump to booking Topological Materials Growth Brief description The Topological Materials dual chamber MBE has been designed for epitaxial […]
Leica VB6 UHR
Leica VB6 UHR Leica VB6 UHR Brief description The Leica VB6 UHR electron beam lithography machine is used for nanoscale patterning of semiconductor structures. This state-of-the-art system uses an electron beam of diameter 4nm and energy up to 100kV. It is capable of patterning substrates of up to 200mm diameter with a resolution as high […]
