Core Nanofabrication

The Core Nanofabrication cleanrooms provide the ideal environment to produce high-quality devices. With an extensive range of equipment, they can support activities with a broad variety of materials including compound semiconductors, silicon, diamond and organic semiconductor materials from chips to small batches of wafers.

The cleanrooms offer a full range of routine fabrication capabilities including:

  • Mask-based photolithography (chips to 6” wafers)
  • Thermal and e-beam evaporation of metals
  • Dielectric deposition by PECVD and ALD
  • Dry etching of dielectrics, compound semiconductor materials and silicon
  • Metrology, inspection and testing
  • Cleaving, Sawing and die packaging

  • Mask-based photolithography (chips to 6” wafers)
  • Thermal and e-beam evaporation of metals
  • Dielectric deposition by PECVD and ALD
  • Dry etching of dielectrics, compound semiconductor materials and silicon
  • Metrology, inspection and testing
  • Cleaving, Sawing and die packaging

Our Capabilities

Manual spin coaters, manual mask aligners, manual development for chips and small wafers up to 3” diameter….

Including hydrofluoric acid (HF) etches

Dielectrics, III-V materials, potentially silicon (mainly for photonics, mems)

Thermal, sputter, self-contained systems for deposition of thermal and beam evaporation. Deposition of single films and multilayer stacks of metal.

Including plasma-enhanced chemical vapor deposition (PECVD) using silicon nitride (SiNx) and silicon oxide (SiOx), and thermal atomic layer deposition (ALD).

Surface profiling (stylus; AFM), Dielectric thin film characterisation (ellipsometry), optical microscopy.

Wafer cleaving and sawing plus basic device packaging.

Dedicated laminar flow wet benches for work with solvents and water-based reagents.

Operating Modes

User Mode

Service Mode

Enquire about this facility

Get in touch with us and start your conversation with our team or book your access to the facility on the PPMS user login page.