Manual spin coaters, manual mask aligners, manual development for chips and small wafers up to 3” diameter….
Dielectrics, III-V materials, potentially silicon (mainly for photonics, mems)
Thermal, sputter, self-contained systems for deposition of thermal and beam evaporation. Deposition of single films and multilayer stacks of metal.
Including plasma-enhanced chemical vapor deposition (PECVD) using silicon nitride (SiNx) and silicon oxide (SiOx), and thermal atomic layer deposition (ALD).
Surface profiling (stylus; AFM), Dielectric thin film characterisation (ellipsometry), optical microscopy.
Dedicated laminar flow wet benches for work with solvents and water-based reagents.
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