Wafer cleaving and sawing

Wafer cleaving and sawing Brief description Wafer cleaving and sawing, as well as basic device packaging. Jump to booking Wafer cleaving and sawing Brief description Wafer cleaving and sawing, as well as basic device packaging Jump to enquiry Applications and uses To complete the device fabrication process, techniques to singulate individual devices and then to […]

Metrology, inspection and testing

Metrology, inspection and testing​ Brief description Surface profiling (stylus; AFM, dektak) Dielectric thin film characterisation (ellipsometry) optical microscopy and probe stations   Jump to booking Brief description Surface profiling (stylus; AFM, dektak) Dielectric thin film characterisation (ellipsometry) optical microscopy and probe stations    Jump to enquiry Metrology, inspection and testing Applications and uses We offer […]

Dielectric Deposition

Dielectric deposition Brief description Including plasma-enhanced chemical vapor deposition (PECVD) of silicon nitride (SiNx) and silicon oxide (SiOx), thermal atomic layer deposition (ALD) and e-beam evaporation of AlOx.   Jump to booking Dielectric deposition Brief description Including plasma-enhanced chemical vapor deposition (PECVD) of silicon nitride (SiNx) and silicon oxide (SiOx), thermal atomic layer deposition (ALD) […]

Deposition of Metals

Deposition of metals Brief description A small suite of thermal and e-beam evaporators, for the depositions of single films or multilayer stacks. Typically the available metals are grouped into ohmic material or gates material (see below). The evaporators can accommodate chips upto 4″ wafers with a range of uniformity (see below).   Jump to booking […]

Dry etching

Dry Etching Brief description We have a small suite of dry etch tools for both reactive ion etching (RIE) and inductively coupled plasma (ICP) etching. These tools have a range of process gases, with dedicated tools for Chlorine-based etching of III-V semiconductors and Fluorine-based etching of dielectrics.    Jump to booking Dry Etching Brief description We have […]

Wet processing

Wet processing Brief description Dedicated laminar flow wet benches for work with solvents and acids. Wet etching and cleaning of samples, ranging in size from chips upto 4″ wafers. This includes using hydrofluoric acid (HF) and piranha for etching/cleaning.    Jump to booking Wet processing Brief description Dedicated laminar flow wet benches for work with […]

Photolithography

Photolithography Brief description Our nanofabrication photolithography room has manual spin coaters and manual mask aligners for chips and up to 3″ wafers, utilising a range of resists and manual development processes.   Jump to booking Photolithography Brief description Our nanofabrication photolithography room has manual spin coaters and manual mask aligners for chips and up to […]

Core Nanofabrication

Core Nanofabrication The Core Nanofabrication cleanrooms provide the ideal environment to produce high-quality devices. With an extensive range of equipment, they can support activities with a broad variety of materials including compound semiconductors, silicon, diamond and organic semiconductor materials from chips to small batches of wafers. The cleanrooms offer a full range of routine fabrication […]